Alphacool Apex Thermal Putty X1-50g (14945) High-Performance Thermal Interface Material for Electronic Components
USD 81
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Apex Thermal Putty is the superior alternative to traditional thermal pads, offering exceptional thermal conductivity while remaining electrically non-conductive.
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What Stands Out
Product Details
| Power Connector Type | 2-Pin |
| Voltage | 1 Volts |
| Wattage | 1 watts |
| Compatible Devices | graphics cards, memory chips, voltage regulators, heat-sensitive electronic components |
| Brand Name | Alphacool |
| Manufacturer | Alphacool |
| Number of Items | 1 |
| Model | 14945 |
| Part Number | 14945 |
| Item Weight | 0.15 Pounds (70 grams) |
| Brand | Alphacool |
Who Should Buy?
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DIY PC Builders
Ideal for those constructing custom PCs, as the putty ensures efficient thermal transfer between components.
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Overclocking Enthusiasts
Great for users pushing hardware limits, providing superior cooling performance under high-stress conditions for stability.
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Electronics Repairers
Useful for technicians needing reliable thermal interface material to enhance component longevity and repair efficiency.
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Casual Users
Not suited for users with standard setups that do not require specialized thermal management.
Product Description
Alphacool Apex Thermal Putty X1-50g (14945) High-Performance Thermal Interface Material for Electronic Components
Customer Questions & Answers
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Question:
Can Apex Thermal Putty replace traditional thermal pads?
Answer: Yes, it is designed as a superior alternative to traditional thermal pads, providing better thermal conductivity. -
Question:
Is it safe to use on sensitive electronic components?
Answer: Absolutely, it protects delicate components and is non-electrically conductive. -
Question:
What is the minimum bond line thickness for this product?
Answer: The minimum bond line thickness is 0.2mm, reducing thermal resistance effectively.
Alphacool Silicone Adhesives Editorial Review
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USD 81
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Features & Benefits
- High-performance, non-curing silicone gel formula for exceptional thermal conductivity.
- Conforms to varying gap heights, ensuring reliable contact for optimal cooling.
- Minimal bond line thickness (0.2mm) reduces thermal resistance for enhanced heat dissipation.
- Protects sensitive components from mechanical stress during installation and operation.
- Perfect processing consistency guarantees stability and effective compensation for surface unevenness.
- Ideal for use with memory, VRM, and other heat-generating electronics.
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